Buehler MiniMet 1000

Buehler MiniMet 1000

The MiniMet 1000 Compact Grinder-Polisher is a versatile, semi-automatic grinding and polishing system designed for laboratories and environments with limited space. Its lightweight and compact design makes it ideal for hot/glove boxes, handling irradiated samples, and use in specialized metallographic applications. Equipped with an automatic arm for enhanced precision and ease of use, the MiniMet 1000 ensures consistent, high-quality results for various sample preparation needs.

Features of MiniMet 1000 Compact Grinder-Polisher

1 . Compact and Space-Saving Design

    1. Lightweight and compact dimensions are perfect for small spaces, including hot and glove boxes.
    2. Designed to handle irradiated and delicate specimens efficiently.

2. High Quality and Consistency

    1. Features an automatic arm that rotates through the X and Y planes, ensuring even polishing and uniform results.
    2. Compatible with CarbiMet® grinding paper and premium polishing cloths for exceptional surface finishes.

3. Flexible Applications for Various Needs

    Ideal for preparing:

      1. Metallographic mounted specimens for microscopic analysis.
      2. Petrographic thin sections for geological studies.
      3. Thinning unmounted specimens for TEM (Transmission Electron Microscopy).
      4. Wafer polishing for electronic and material research.

4. Wide Range of Accessories and Consumables

    1. Supports a variety of processing bowls, specimen fixtures, glass platens, and consumables.
    2. Compatible with small grinding papers and polishing cloths tailored for specific applications.

    Applications of MiniMet 1000 Compact Grinder-Polisher

    1. Metallographic Laboratories
      • Precision grinding and polishing for mounted and unmounted specimens in material analysis.
    2. Petrography and Geology
      • Ideal for preparing thin sections of geological samples with consistent results.
    3. Microscopic and Electron Microscopy Research
      • Enables precise specimen thinning and polishing for TEM and other microscopic techniques.
    4. Semiconductor and Wafer Industries
      • Efficient and reliable polishing of wafers and other delicate materials.
    Features Description
    MiniMet 1000
    Dimensions 7in W x 16in D x 8in H (180mm x 400mm x 200mm)
    Electrical 85 – 264 Volts / 50 – 60Hz / 1 phase
    Shipping Weight 25lbs (11kg)
    Sound 1 meter high and 1 meter away from the front of the machine, with no load
    Consumable Grit Size - ANSI [FEPA] Micron Part Number
    CarbiMet Consumables
    CarbiMet™ 120 [P120] 120 127 36-02-0120
    CarbiMet™ 180 [P180] 180 78 36-02-0180
    CarbiMet™ 240 [P280] 240 52 36-02-0240
    CarbiMet™ 320 [P400] 320 35 36-02-0320
    CarbiMet™ 400 [P800] 400 22 36-02-0400
    CarbiMet™ 600 [P1200] 600 15 36-02-0600
    MicroCut Consumables
    MicroCut™ 800 [P1500] 800 13 36-02-0800
    MicroCut™ 1200 [P2500] 1200 8 36-02-1200
    Polishing Cloths
    UltraPol™ Coarse N/A 40-7442
    Nylon Intermediate N/A 40-7052
    TexMet™ C Intermediate N/A 40-1102
    TriDent™ Intermediate N/A 40-7502
    MicroCloth® Fine N/A 40-7212
    MasterTex® Fine N/A 40-7702
    ChemoMet® Fine N/A 40-7902
    PSA Backed, 2.875in [73mm] Qty 20
    SiC Paper PSA Backed, 2.875in [73mm] Qty 100

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